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Dual, SiGe High-Linearity, 3000MHz to
4000MHz Downconversion Mixer with LO Buffer
ABSOLUTE MAXIMUM RATINGS
V CC to GND ...........................................................-0.3V to +5.5V
RF_, LO to GND.....................................................-0.3V to +0.3V
IFM_, IFD_, IFM_SET, IFD_SET, LO_ADJ_M,
LO_ADJ_D to GND.................................-0.3V to (V CC + 0.3V)
RF_, LO Input Power ......................................................+15dBm
RF_, LO Current (RF and LO are DC shorted to GND
through balun).................................................................50mA
θ JA (Notes 2, 3)..............................................................+38°C/W
θ JC (Note 3).....................................................................7.4°C/W
Operating Case Temperature Range
(Note 4) ...................................................T C = -40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Continuous Power Dissipation (Note 1) ..............................8.7W
Note 1: Based on junction temperature T J = T C + ( θ JC x V CC x I CC ). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 2: Junction temperature T J = T A + ( θ JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Note 4: T C is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, no input RF or LO signals applied, V CC = +4.75V to +5.25V, T C = -40°C to +85°C. Typical values are at
V CC = +5.0V, T C = +25°C, unless otherwise noted. R1 = R4 = 750 Ω , R2 = R5 = 698 Ω .)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
Supply Current
V CC
I CC
Total supply current
4.75
5
388
5.25
420
V
mA
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , no input RF or LO signals applied, T C = -40°C to +85°C. Typical values are at
V CC = +3.3V, T C = +25°C, unless otherwise noted. R1 = R4 = 1.1k Ω ; R2 = R5 = 845 Ω .) (Note 5)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V CC
I CC
CONDITIONS
(Note 6)
Total supply current
MIN
3
TYP
3.3
279
MAX
3.6
UNITS
V
mA
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER
RF Frequency
LO Frequency
SYMBOL
f RF
f LO
(Notes 5, 7)
(Notes 5, 7)
CONDITIONS
MIN
3000
2650
TYP
MAX
4000
3700
UNITS
MHz
MHz
Using Mini-Circuits TC4-1W-17 4:1
transformer as defined in the Typical
Application Circuit , IF matching
components affect the IF frequency range
100
500
IF Frequency
f IF
(Notes 5, 7)
MHz
Using alternative Mini-Circuits TC4-1W-7A
4:1 transformer, IF matching components
affect the IF frequency range (Notes 5, 7)
50
250
LO Drive Level
P LO
(Note 7)
-3
+3
dBm
2
_______________________________________________________________________________________
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